When mining the cutting level, usually the wire rope moves in a clockwise direction. According to the actual situation of the venue, it can also move in the counterclockwise direction. When mining and cutting the vertical plane, the wire rope moves from bottom to top. This is that the cooling water is brought into the saw seam from bottom to top by the wire rope. The cooling water can increase the time of staying in the saw seam due to the action of gravity, and improve the cooling effect of the wire rope. At the same time, it also facilitates the discharge of chips. If the wire rope is used to cut from the top to the bottom, the powdery chips will be deposited down in the cutting seam below, causing the blockage of the cutting seam. But at present, there are also wire ropes that cut the movement direction from top to bottom, and the sawing effect is also ideal. Separate body collapse or waste material of plastic cutting, if you are at the bottom of the cut surface is open, in the vertical plane cutting, can according to need to use wire rope top-down direction, open the bottom will not result in a chip deposit blocking kerf, on the contrary, will be wire rope is advantageous to the cooling water as much as possible to the deeper at the bottom of the saw seam position. When using the movement direction of the wire rope, it is necessary to take protective measures for the direction of the movement track of the wire rope. The wire rope after leaving the factory is marked with the cutting direction of the wire rope on the injection layer. Even if the wire rope has not been edged, most of the wire ropes are marked with the cutting motion direction, so before using the wire rope, first, identify the cutting direction mark of the wire rope, and make the marked cutting motion direction consistent with the actual cutting direction. If the cutting direction is wrong, especially if the cutting direction of the edged wire rope is wrong, it will affect the service life of the wire rope and waste a lot of time due to re-blade.
